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- Thermal Conductive FR-4.0
- Copper Base CCL
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- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- Stiffener
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- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- Rigid Materials
- RF Materials
- Automotive Materials
- Flexible Materials
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- 2017
- 2016
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- 2014
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- 2011
- 2010
- 2007
- 2006
- 2004
- 2002
- 2000
- 1999
- 1998
- 1994
- 1990
- 1985
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
- 2018
- 2019
- 2020
- 2021
- 2022
- 2023
- 2024
- HDI
- HDI
- UL File (Download)
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
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- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
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- Ultra-low Loss Material
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- Low-loss Material
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- Automotive materials
- Conventional FR-4
- Lead Free Compatible FR-4.0, FR-15.0
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- CEM-3, CEM-3.1
- CEM-1
- Flexible copper clad laminate
- Coverlay
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- Shengyi Technology
- Shaanxi Shengyi
- Suzhou Shengyi
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